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Tunnel Application Data |
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Typical Detector Circuits
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Chip (C2) Assembly Notes |
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Thermo Compression Wedge Bonding: |
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| 1.Use 0.7 mil gold wire. | ||
| 2.Tip temperature =180°C MAX | ||
| 3.Stage temperature =160°C MAX | ||
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Die attach. |
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| 1.Silver epoxy with a maximum cure | ||
| temperature of 125°C is recommended | ||
Package Assembly Notes |
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| Lead Attach | ||
| 1.230°C Solder attach for 5 sec. MAX. | ||
CAUTION! |
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Extremely Static Sensitive Devices |
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| Notes |
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1.Chip top is cathode. |
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2. Detected output will be negative |
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| from the cathode contact. | ||